TSMC Unveils 2nm and Future Chip Manufacturing Plans
26 April 2025 · Uncategorized ·
Result
A14工艺：助力人工智能时代
The A14 process is a significant advancement over the existing 2-nanometer (N2) process, designed to accelerate artificial intelligence (AI) development by delivering faster computing speeds and improved energy efficiency. This new manufacturing method may also enhance on-device AI capabilities in smartphones.
Diversified Technology Portfolio
- High-Performance Computing: TSMC is advancing its CoWoS technology and Chip-on-Wafer-X (SoW-X) solutions, aiming to create systems equivalent in size to an entire wafer. These systems are projected to offer 40 times the computing power of existing solutions. This advanced packaging and integration technology will provide substantial performance enhancements for AI and other high-end applications.
- Smartphones: TSMC has introduced the new N4C RF radio frequency technology, which reduces power consumption and area by 30% compared to previous generations like N6RF+. This makes it ideally suited for applications requiring high-speed connectivity, such as devices supporting Wi-Fi 8 standards and advanced, AI-powered true wireless stereo headphones.
- Automotive: TSMC is already manufacturing chips for the automotive industry using its advanced N3A process technology, and these products have achieved AEC-Q100 Grade 1 certification. This technology will help realize the vision of future “software-defined” vehicles.
- Internet of Things (IoT): To meet the increasing demand for computing power while maintaining low energy consumption, TSMC has introduced the ultra-low-power N6e process and will continue to refine its more advanced N4e process.
A Future-Forward Commitment
By showcasing a range of innovative solutions and technological advancements – including the various process technologies, packaging technologies, and 3D stacking techniques mentioned above – TSMC demonstrates its commitment not only to current market leadership but also to proactively addressing future trends and development opportunities. Company executives have stated that they will continue to build upon the industry-leading N2 process to advance the A14 process and plan to introduce more products based on these advanced manufacturing technologies in the coming quarter.
Conclusion
As artificial intelligence and other high-end applications continue to evolve rapidly, the demand for computing power is constantly increasing. TSMC, as the world’s largest dedicated semiconductor foundry, possesses a distinct advantage in researching and mass-producing advanced technologies, enabling it to continuously lead the industry, provide reliable innovation roadmaps for customers, and drive progress and development across the entire sector.
A14工艺：助力人工智能时代
The A14 process is a significant advancement over the existing 2-nanometer (N2) process, designed to accelerate artificial intelligence (AI) development by delivering faster computing speeds and improved energy efficiency. This new manufacturing method may also enhance on-device AI capabilities in smartphones.
Diversified Technology Portfolio
- High-Performance Computing: TSMC is advancing its CoWoS technology and Chip-on-Wafer-X (SoW-X) solutions, aiming to create systems equivalent in size to an entire wafer. These systems are projected to offer 40 times the computing power of existing solutions. This advanced packaging and integration technology will provide substantial performance enhancements for AI and other high-end applications.
- Smartphones: TSMC has introduced the new N4C RF radio frequency technology, which reduces power consumption and area by 30% compared to previous generations like N6RF+. This makes it ideally suited for applications requiring high-speed connectivity, such as devices supporting Wi-Fi 8 standards and advanced, AI-powered true wireless stereo headphones.
- Automotive: TSMC is already manufacturing chips for the automotive industry using its advanced N3A process technology, and these products have achieved AEC-Q100 Grade 1 certification. This technology will help realize the vision of future “software-defined” vehicles.
- Internet of Things (IoT): To meet the increasing demand for computing power while maintaining low energy consumption, TSMC has introduced the ultra-low-power N6e process and will continue to refine its more advanced N4e process.
A Future-Forward Commitment
By showcasing a range of innovative solutions and technological advancements – including the various process technologies, packaging technologies, and 3D stacking techniques mentioned above – TSMC demonstrates its commitment not only to current market leadership but also to proactively addressing future trends and development opportunities. Company executives have stated that they will continue to build upon the industry-leading N2 process to advance the A14 process and plan to introduce more products based on these advanced manufacturing technologies in the coming quarter.
Conclusion
As artificial intelligence and other high-end applications continue to evolve rapidly, the demand for computing power is constantly increasing. TSMC, as the world’s largest dedicated semiconductor foundry, possesses a distinct advantage in researching and mass-producing advanced technologies, enabling it to continuously lead the industry, provide reliable innovation roadmaps for customers, and drive progress and development across the entire sector.