MOIEE & Industries Introduce Panel-Level Wet TGV Solution for Advanced Packaging
18 April 2025 路 Uncategorized 路
Source: 路 https://technews.tw/2025/04/16/2025-touch-taiwan-itri/
Touch Taiwan commenced today (October 16th), featuring 27 research achievements from the Industrial Technology Research Institute of Ministry of Economic Affairs, in collaboration with AU Optronics, Innolux Corporation, DaYun Precision Industry Co., Ltd., Lianche Tech Inc., Chengba Electronics and Yongguang Optoelectronics Group. Notably among these is a globally unprecedented 'panel-level packaging high aspect ratio full wet TGV solution,' which overcomes traditional process limitations by increasing the filling hole depth-to-width ratio of 12-inch wafers to 15, resulting in density improvements exceeding fifty percent and reduced production costs.
To address requirements for next-generation advanced packaging, MOIEE's Industrial Technology Research Institute has successfully developed this 'panel-level packaging high aspect ratio full wet TGV solution.' This technology leverages the advantages of panel level packaging (PLP)鈥攏amely its large area, low cost, and high performance鈥攆urther increasing depth-to-width ratios to 15. It also incorporates ultra-high-speed laser modification and etching technologies that increase drilling speed tenfold, effectively enhancing package density and conductivity efficiency while ensuring full domestic sourcing for materials and equipment.
Furthermore, MOIEE's Industrial Technology Research Institute has established a panel-level packaging technology research alliance and industrial chain with device manufacturers such as Lianche Tech Inc., Chengba Electronics Co., Ltd. This collaboration focuses on the joint development of all-wet processes, materials, and devices to provide comprehensive solutions for high aspect ratio advanced package manufacturing.
MOIEE's Industrial Technology Research Institute also presented a 'Micro LED Quantum Dot Color Conversion Film,' utilizing solvent-free quantum dot ink and digital exposure barrier layer material to double material utilization rates while reducing costs and carbon emissions. This innovation simultaneously eliminates two photolithography masks used in traditional yellow light processes, resolving the issue of material waste.
Finally, they showcased continuous depth-of-field 3D AR-HUD technology, a transparent array antenna module for 5G mobile communication networks, and integrated eye-tracking technology into smart glasses to enhance technological convenience.
To address requirements for next-generation advanced packaging, MOIEE's Industrial Technology Research Institute has successfully developed this 'panel-level packaging high aspect ratio full wet TGV solution.' This technology leverages the advantages of panel level packaging (PLP)鈥攏amely its large area, low cost, and high performance鈥攆urther increasing depth-to-width ratios to 15. It also incorporates ultra-high-speed laser modification and etching technologies that increase drilling speed tenfold, effectively enhancing package density and conductivity efficiency while ensuring full domestic sourcing for materials and equipment.
Furthermore, MOIEE's Industrial Technology Research Institute has established a panel-level packaging technology research alliance and industrial chain with device manufacturers such as Lianche Tech Inc., Chengba Electronics Co., Ltd. This collaboration focuses on the joint development of all-wet processes, materials, and devices to provide comprehensive solutions for high aspect ratio advanced package manufacturing.
MOIEE's Industrial Technology Research Institute also presented a 'Micro LED Quantum Dot Color Conversion Film,' utilizing solvent-free quantum dot ink and digital exposure barrier layer material to double material utilization rates while reducing costs and carbon emissions. This innovation simultaneously eliminates two photolithography masks used in traditional yellow light processes, resolving the issue of material waste.
Finally, they showcased continuous depth-of-field 3D AR-HUD technology, a transparent array antenna module for 5G mobile communication networks, and integrated eye-tracking technology into smart glasses to enhance technological convenience.