E Ink, Realtek Enhance ESLs with New Generation SoC
25 March 2025 · Uncategorized ·
E Ink Holdings (元太科技), a leading electronic paper manufacturer, and Realtek Semiconductor Corp. (瑞昱半導體) have jointly launched a second-generation System on Panel (SoP)-integrated demonstration model for Electronic Shelf Labels (ESLs). This collaboration aims to simplify the development process for e-paper labels.
The SoP technology integrates circuits into either glass or flexible substrates of electronic paper displays, combining IC chips, panels, and systems. The new design incorporates Realtek’s Bluetooth chip using a Chip on Glass (CoG) packaging technique—a first in the industry—embedding an RF-IC onto a glass substrate. This innovation reduces material usage, minimizes product size, streamlines manufacturing processes, and contributes to more efficient and environmentally friendly e-paper display solutions.
Compared to previous models of equivalent screen sizes, the second-generation design has reduced Thin Film Transistors (TFTs) by nearly 30% and Flexible Printed Circuit Boards (FPCs) by half. This enables ESL partners within the electronic paper ecosystem to develop sleeker products with narrower bezels that can seamlessly complement various retail store aesthetics.
The new design also enhances overall efficiency through optimized circuit layouts and transmission line designs, achieving signal transmissions comparable to traditional ESL models while maintaining commercial application characteristics. Furthermore, stacking FPCs behind panels further reduces device size and conserves materials.
Leveraging Realtek’s next-generation Redistribution Layer (RDL), the second-generation SoP integrates RF chips onto a 2.66-inch e-paper display glass substrate instead of relying on conventional wire bonding packaging methods.
This deep integration between semiconductor and panel technologies establishes a strong foundation for future retail products. According to Lee Cheng-Hao (李政昊), chairman of E Ink Holdings, ESLs replacing paper labels offer retailers increased operational efficiency and reduced energy consumption.
(Picture source: E Ink Holdings)
The SoP technology integrates circuits into either glass or flexible substrates of electronic paper displays, combining IC chips, panels, and systems. The new design incorporates Realtek’s Bluetooth chip using a Chip on Glass (CoG) packaging technique—a first in the industry—embedding an RF-IC onto a glass substrate. This innovation reduces material usage, minimizes product size, streamlines manufacturing processes, and contributes to more efficient and environmentally friendly e-paper display solutions.
Compared to previous models of equivalent screen sizes, the second-generation design has reduced Thin Film Transistors (TFTs) by nearly 30% and Flexible Printed Circuit Boards (FPCs) by half. This enables ESL partners within the electronic paper ecosystem to develop sleeker products with narrower bezels that can seamlessly complement various retail store aesthetics.
The new design also enhances overall efficiency through optimized circuit layouts and transmission line designs, achieving signal transmissions comparable to traditional ESL models while maintaining commercial application characteristics. Furthermore, stacking FPCs behind panels further reduces device size and conserves materials.
Leveraging Realtek’s next-generation Redistribution Layer (RDL), the second-generation SoP integrates RF chips onto a 2.66-inch e-paper display glass substrate instead of relying on conventional wire bonding packaging methods.
This deep integration between semiconductor and panel technologies establishes a strong foundation for future retail products. According to Lee Cheng-Hao (李政昊), chairman of E Ink Holdings, ESLs replacing paper labels offer retailers increased operational efficiency and reduced energy consumption.
(Picture source: E Ink Holdings)