Intel, Yuan Shan, and Micron Collaborate on Advanced Fluid Cooling Technology
24 March 2025 · Uncategorized ·
Source: · https://finance.technews.tw/2025/03/17/superfluid/
At the annual GTC conference held by NVIDIA in San Jose, California on March 17th, CEO Jensen Huang is expected to unveil their new GB300 AI chip. The chip’s higher heat dissipation requirements have spurred supply chain alliances vying for orders; notably, Intel has partnered with Kuang Yun Precision Industry Co., Ltd., Micron Technology Inc., Yuan Shan Electronics, and Sheng Ming Electric Co., Ltd. to develop a unique “superfluid cooling technology.”
According to *The Economic Daily News*, Intel recently hosted the "2025 Superfluid Advanced Cooling Technology Forum" in Taiwan, inviting Taiwanese supply chain partners for extensive discussions on addressing kilowatt-level chip heat dissipation challenges faced by data centers. This initiative aims to foster collaboration with local suppliers and jointly develop this unique technology to secure orders related to NVIDIA’s liquid cooling solutions.
Intel has appointed Chen Lishu as the new CEO, expressing confidence in reviving the company through key initiatives like superfluid cooling technology—a system introduced in 2023 that enhances water block heat dissipation while utilizing non-conductive dielectric fluids to mitigate potential leakage risks associated with traditional liquid-cooling systems.
The “superfluid cooling technology” has demonstrated effectiveness in dissipating thermal loads of up to 1,500 watts for AI chips—a capability well aligned with NVIDIA’s next-generation GB300 server heat dissipation needs. Intel is collaborating closely with Micron Technology Inc., Yuan Shan Electronics, Kuang Yun Precision Industry Co., Ltd., and Sheng Ming Electric among others on this technology's development.
Micron Technology Inc. and Yuan Shan showcased products related to the “superfluid cooling technology” at that time, attracting significant market attention. Meanwhile, Sheng Ming supplies AI server cabinets; Hongzhi Industrial Corporation and Chifeng Electronics provide heat dissipation components while Kuang Yun Precision Industry offers liquid-cooled mainframes and water-cooling back doors.
Kuang Yun is intensifying its focus on the cooling business sector in anticipation of NVIDIA’s GB300 launch, which will likely establish liquid cooling as a mainstream technology. Intel aims to reclaim past successes with this unique “superfluid cooling technology.”
(Image source: TechNews.)
According to *The Economic Daily News*, Intel recently hosted the "2025 Superfluid Advanced Cooling Technology Forum" in Taiwan, inviting Taiwanese supply chain partners for extensive discussions on addressing kilowatt-level chip heat dissipation challenges faced by data centers. This initiative aims to foster collaboration with local suppliers and jointly develop this unique technology to secure orders related to NVIDIA’s liquid cooling solutions.
Intel has appointed Chen Lishu as the new CEO, expressing confidence in reviving the company through key initiatives like superfluid cooling technology—a system introduced in 2023 that enhances water block heat dissipation while utilizing non-conductive dielectric fluids to mitigate potential leakage risks associated with traditional liquid-cooling systems.
The “superfluid cooling technology” has demonstrated effectiveness in dissipating thermal loads of up to 1,500 watts for AI chips—a capability well aligned with NVIDIA’s next-generation GB300 server heat dissipation needs. Intel is collaborating closely with Micron Technology Inc., Yuan Shan Electronics, Kuang Yun Precision Industry Co., Ltd., and Sheng Ming Electric among others on this technology's development.
Micron Technology Inc. and Yuan Shan showcased products related to the “superfluid cooling technology” at that time, attracting significant market attention. Meanwhile, Sheng Ming supplies AI server cabinets; Hongzhi Industrial Corporation and Chifeng Electronics provide heat dissipation components while Kuang Yun Precision Industry offers liquid-cooled mainframes and water-cooling back doors.
Kuang Yun is intensifying its focus on the cooling business sector in anticipation of NVIDIA’s GB300 launch, which will likely establish liquid cooling as a mainstream technology. Intel aims to reclaim past successes with this unique “superfluid cooling technology.”
(Image source: TechNews.)