Russia Targets 28nm Chip Production by 2030, Shifting Away from x86 and Arm
26 April 2025 路 Uncategorized 路
Russia is pursuing a plan to achieve domestic mass production of 28nm chips by 2030, despite facing numerous challenges. According to reports synthesized from the semiconductor industry (ID: ICVIEWS), the Moscow Central Scientific Research Institute for Technology and Manufacturing (MCST) has developed CPUs based on the SPARC architecture, known as Elbrus processors, which meet expectations. However, Konstantin Trushkin, Deputy Director of Development at MCST, emphasized the need to establish a supporting ecosystem before these processors can be effectively utilized in practical applications. He stated that Russia cannot manufacture processors based on the Intel x86 instruction set architecture due to restrictions and will therefore focus on CPUs like Elbrus, utilizing alternative instruction sets. This strategy is driven by concerns about national information security, necessitating reliance on domestic hardware rather than those based on Arm or x86 architectures. Dmitry Gusev from InfoTeKS cautioned about the feasibility of Elbrus processors, citing past difficulties in integrating them into systems due to a lack of software adaptation expertise. He suggested prioritizing ecosystem development through education and investment before broader adoption.
In March 2025, Moscow Mayor Sergey Sobyanin announced on social media that the Zelenograd Nano Technology Center (ZNTC) had developed Russia鈥檚 first 350nm lithography machine, codenamed "Dawn," and was preparing for mass production. Dawn utilizes a solid-state laser source, reducing energy consumption by 30% compared to traditional mercury lamp systems, and features a 22mm x 22mm exposure field capable of covering a 200mm wafer. While benchmarked against ASML's PAS 5500 series from two decades ago, Russian engineers have incorporated military laser technology to enhance light source stability and equipment longevity, with precision optical components supplied by Belarusian Planar Company.
Dawn鈥檚 initial orders are directed toward the defense industry, specifically to produce chips for the S-500 air defense system, replacing previously imported 180nm products from TSMC. In the civilian sector, Gorenje, a Russian home appliance manufacturer, plans to utilize these chips in new products, mirroring a strategy seen in other markets.
Russia has outlined a development roadmap for domestic CAD systems from 2023 to 546 billion rubles. By the end of 2026, Russia aims to master critical manufacturing processes, including single crystal growth, wafer slicing, grinding, polishing, washing, drying, element application, and output product control, utilizing techniques like X-ray diffraction for quality assurance. Furthermore, the roadmap includes the development of photolithography equipment for 350nm and 130nm processes, alongside electron beam lithography equipment for 150nm production.
By 2030, Russia intends to independently produce photolithography systems capable of manufacturing chips with feature sizes as small as 90nm or even 65nm, a goal that would significantly enhance Russia's microelectronics production capabilities, though it would still lag behind global industry leaders. Konstantin Trushkin acknowledged that Russia鈥檚 efforts will be substantial, but it will remain behind leading-edge technology.
Note: This article reflects the author's perspective and is presented for informational purposes. Any objections or concerns should be directed to the source.
In March 2025, Moscow Mayor Sergey Sobyanin announced on social media that the Zelenograd Nano Technology Center (ZNTC) had developed Russia鈥檚 first 350nm lithography machine, codenamed "Dawn," and was preparing for mass production. Dawn utilizes a solid-state laser source, reducing energy consumption by 30% compared to traditional mercury lamp systems, and features a 22mm x 22mm exposure field capable of covering a 200mm wafer. While benchmarked against ASML's PAS 5500 series from two decades ago, Russian engineers have incorporated military laser technology to enhance light source stability and equipment longevity, with precision optical components supplied by Belarusian Planar Company.
Dawn鈥檚 initial orders are directed toward the defense industry, specifically to produce chips for the S-500 air defense system, replacing previously imported 180nm products from TSMC. In the civilian sector, Gorenje, a Russian home appliance manufacturer, plans to utilize these chips in new products, mirroring a strategy seen in other markets.
Russia has outlined a development roadmap for domestic CAD systems from 2023 to 546 billion rubles. By the end of 2026, Russia aims to master critical manufacturing processes, including single crystal growth, wafer slicing, grinding, polishing, washing, drying, element application, and output product control, utilizing techniques like X-ray diffraction for quality assurance. Furthermore, the roadmap includes the development of photolithography equipment for 350nm and 130nm processes, alongside electron beam lithography equipment for 150nm production.
By 2030, Russia intends to independently produce photolithography systems capable of manufacturing chips with feature sizes as small as 90nm or even 65nm, a goal that would significantly enhance Russia's microelectronics production capabilities, though it would still lag behind global industry leaders. Konstantin Trushkin acknowledged that Russia鈥檚 efforts will be substantial, but it will remain behind leading-edge technology.
Note: This article reflects the author's perspective and is presented for informational purposes. Any objections or concerns should be directed to the source.