TSMC Announces Strong March Revenue and Solid First Quarter Results
14 April 2025 · Uncategorized ·
Source: · https://finance.technews.tw/2025/04/10/tsmcs-revenue-increased-by-10-in-march/
Taiwan Semiconductor Manufacturing Company (TSMC, 台積電) reported its revenue for March 2025. Consolidated revenues reached approximately NT$285.96 billion in March 2025, a rise of roughly 10% from February and an increase of around 46.5% compared to the same period last year (March 2024). For Q1 2025 overall, revenues totaled approximately NT$839.25 billion—a growth rate of about 41.6% over the corresponding quarter in 2024.
TSMC previously forecast a first-quarter consolidated revenue between $25 and $25.8 billion USD. Assuming an exchange rate of NT$32.8 per US dollar, TSMC’s Q1 revenues were estimated to fall within the range of NT$820–NT$846.24 billion with a midpoint estimate of approximately NT$833.12 billion; this latest figure aligns well with market expectations.
During a recent earnings call, Chairman and CEO C.C. Wei (魏哲家) stated that semiconductor inventory levels in 2025 are expected to be healthier than those seen the previous year, predicting overall industry growth of approximately 10%. TSMC anticipates its dollar revenue will grow by roughly 24%–26%, exceeding average sector performance. The company’s long-term goal remains unchanged with a projected compound annual growth rate (CAGR) nearing 20%.
Demand for AI-related products continues to surge strongly; in fact, TSMC's revenue from these applications tripled last year and now accounts for approximately 14–16% of total sales. The company projects that this segment will double again during the current fiscal year with a CAGR approaching 44%–46%, serving as a key driver within their High Performance Computing (HPC) platform.
Responding to robust demand from markets such as 5G, AI, and HPC for advanced processes and packaging technologies, TSMC has estimated its capital expenditure in 2025 will range between $38 billion and $42 billion USD. Approximately seventy percent of this investment is allocated towards leading-edge manufacturing techniques; the remaining portion (10%–20%) will be directed to specialized process technology, advanced packaging/testing/mask making, and other areas.
Recently, C.C. Wei announced a four-year US$100 billion investment plan during a visit to America. This includes building three additional cutting-edge semiconductor fabrication plants, two new facilities for leading-edge package production, and one major research center dedicated to development teams. The total amount invested by TSMC in the U.S., including this latest commitment, now stands at an astounding US$165 billion (approximately NT$5480 billion), aimed at meeting customer needs within that region.
TSMC plans on holding its Q1 2025 earnings call on April 17th; analysts are expected to focus heavily upon the company’s expanded U.S.-based investments, changes in AI markets, and impacts stemming from Trump-era tariffs.
(Lead image source: TSMC)
TSMC previously forecast a first-quarter consolidated revenue between $25 and $25.8 billion USD. Assuming an exchange rate of NT$32.8 per US dollar, TSMC’s Q1 revenues were estimated to fall within the range of NT$820–NT$846.24 billion with a midpoint estimate of approximately NT$833.12 billion; this latest figure aligns well with market expectations.
During a recent earnings call, Chairman and CEO C.C. Wei (魏哲家) stated that semiconductor inventory levels in 2025 are expected to be healthier than those seen the previous year, predicting overall industry growth of approximately 10%. TSMC anticipates its dollar revenue will grow by roughly 24%–26%, exceeding average sector performance. The company’s long-term goal remains unchanged with a projected compound annual growth rate (CAGR) nearing 20%.
Demand for AI-related products continues to surge strongly; in fact, TSMC's revenue from these applications tripled last year and now accounts for approximately 14–16% of total sales. The company projects that this segment will double again during the current fiscal year with a CAGR approaching 44%–46%, serving as a key driver within their High Performance Computing (HPC) platform.
Responding to robust demand from markets such as 5G, AI, and HPC for advanced processes and packaging technologies, TSMC has estimated its capital expenditure in 2025 will range between $38 billion and $42 billion USD. Approximately seventy percent of this investment is allocated towards leading-edge manufacturing techniques; the remaining portion (10%–20%) will be directed to specialized process technology, advanced packaging/testing/mask making, and other areas.
Recently, C.C. Wei announced a four-year US$100 billion investment plan during a visit to America. This includes building three additional cutting-edge semiconductor fabrication plants, two new facilities for leading-edge package production, and one major research center dedicated to development teams. The total amount invested by TSMC in the U.S., including this latest commitment, now stands at an astounding US$165 billion (approximately NT$5480 billion), aimed at meeting customer needs within that region.
TSMC plans on holding its Q1 2025 earnings call on April 17th; analysts are expected to focus heavily upon the company’s expanded U.S.-based investments, changes in AI markets, and impacts stemming from Trump-era tariffs.
(Lead image source: TSMC)