Pan-Crown Technology SAC-TEM Center Breaks Ground on New Facility, Eyeing Post-Angstrom Innovations
3 April 2025 路 Uncategorized 路
Source: 路 https://finance.technews.tw/2025/04/02/sac-tem-center-a-testing-plant-was-officially-launched/
Semiconductor testing firm Pan Crown Technology held a groundbreaking ceremony for its new SAC-TEM Center in Zhubei on February 2nd. Chairman Liu Jilun stated that as semiconductor processes enter the 2nm node stage, there will be an increased demand for precise material analysis (MA) services due to higher complexity of micro etching and materials used.
Pan Crown Technology announced plans for its long-term operational layout in anticipation of future market opportunities brought by Angstrom-era process material analysis. The high-end SAC-TEM Center factory building held a groundbreaking ceremony on February 2nd, featuring an independent single-floor seismic isolation foundation with three-layer steel frame earthquake-resistant design and is expected to be completed for leasing operations during the second half of 2025.
Chairman Liu Jilun explained that as AI technology continues its long-term development towards Angstrom-era semiconductor processes, Pan Crown Technology is intensifying efforts in 'Angstrom-era process material analysis,' 'silicon photonics light leakage detection,' and establishing a dedicated U.S. AI customer zone. With leading advantages in silicon photonic chip testing techniques and precise methods, the company has obtained patents for its optical loss detection devices both domestically and internationally.
Due to increased complexity of micro etching processes and new materials used in semiconductor manufacturing, there is an urgent need for accurate material analysis (MA) services. Pan Crown Technology's inspection centers are designed with high-standard seismic isolation structures equipped with advanced testing equipment tailored to meet specific customer needs while ensuring strict information security measures.
Chairman Liu Jilun further explained that as the industry enters sub-Angstrom processes, semiconductor imaging magnification reaches millions of times, reaching atomic-level images. Therefore, all environmental disturbances and vibrations must be avoided; grounding becomes crucial for device performance. All equipment in SAC-TEM Center has ion-grounding devices to avoid interference through low impedance ground lines combined with new demagnetization designs.
In addition to meeting the testing needs from semiconductor clients, Pan Crown Technology plans global expansion by setting up analysis laboratories in key clusters of semiconductor research and development regions such as Japan and America. These expansions are expected to contribute significantly to operational growth starting 2025.
Pan-Crown views its overall operations with growing silicon photonics and AI chip testing business scales positively, expecting new operation points in Japan and the U.S., along with deepened R&D efforts on inspection techniques and improved service management for analysis commissions. The company is optimistic about better performance in the second half of this year compared to the first.
(Picture source: TechNews)
Pan Crown Technology announced plans for its long-term operational layout in anticipation of future market opportunities brought by Angstrom-era process material analysis. The high-end SAC-TEM Center factory building held a groundbreaking ceremony on February 2nd, featuring an independent single-floor seismic isolation foundation with three-layer steel frame earthquake-resistant design and is expected to be completed for leasing operations during the second half of 2025.
Chairman Liu Jilun explained that as AI technology continues its long-term development towards Angstrom-era semiconductor processes, Pan Crown Technology is intensifying efforts in 'Angstrom-era process material analysis,' 'silicon photonics light leakage detection,' and establishing a dedicated U.S. AI customer zone. With leading advantages in silicon photonic chip testing techniques and precise methods, the company has obtained patents for its optical loss detection devices both domestically and internationally.
Due to increased complexity of micro etching processes and new materials used in semiconductor manufacturing, there is an urgent need for accurate material analysis (MA) services. Pan Crown Technology's inspection centers are designed with high-standard seismic isolation structures equipped with advanced testing equipment tailored to meet specific customer needs while ensuring strict information security measures.
Chairman Liu Jilun further explained that as the industry enters sub-Angstrom processes, semiconductor imaging magnification reaches millions of times, reaching atomic-level images. Therefore, all environmental disturbances and vibrations must be avoided; grounding becomes crucial for device performance. All equipment in SAC-TEM Center has ion-grounding devices to avoid interference through low impedance ground lines combined with new demagnetization designs.
In addition to meeting the testing needs from semiconductor clients, Pan Crown Technology plans global expansion by setting up analysis laboratories in key clusters of semiconductor research and development regions such as Japan and America. These expansions are expected to contribute significantly to operational growth starting 2025.
Pan-Crown views its overall operations with growing silicon photonics and AI chip testing business scales positively, expecting new operation points in Japan and the U.S., along with deepened R&D efforts on inspection techniques and improved service management for analysis commissions. The company is optimistic about better performance in the second half of this year compared to the first.
(Picture source: TechNews)