BESI Semiconductor Secures Hybrid Bonding Orders for HBM4 from Key Manufacturers
26 April 2025 · Uncategorized ·
Source: · https://technews.tw/2025/04/23/besi-hybrid-bonding/
Result
BESI, a supplier of advanced packaging equipment, announced on Wednesday, March 23rd, that its order volume increased in the first quarter, driven by rising demand from Asian foundries for AI-related data center applications. Investors are optimistic about continued growth in orders for BESI’s hybrid bonding solutions, a crucial technology enabling the direct stacking and bonding of chips.
CEO Richard Blickman, in a press release, stated, "We have received hybrid bonding orders from two leading memory chip manufacturers for HBM4, as well as follow-up orders from a leading Asian foundry for logic chips." The company reported a quarterly order value of €131.9 million (approximately $150.1 million), an 8.2% increase compared to the previous quarter.
Despite a year-to-date stock price decline of roughly 30%, BESI's shares rose by approximately 9% following the earnings report. KBC Securities analysts highlighted that these new orders are a positive indicator and reinforce the company’s long-term growth potential, despite potential short-term volatility.
BESI’s first-quarter revenue was €144.1 million, a 6.1% decrease compared to the previous quarter, primarily due to weaker shipments in mobile device and automotive applications. The company anticipates second-quarter revenue to remain consistent, with potential deviations of around 5%. Blickman noted the increasing difficulty in predicting the timing of demand recovery amid escalating trade tensions.
In February, BESI had projected a rebound in the mainstream assembly market beginning in the second half of this year, contingent on terminal market trends and progress in resolving global trade restrictions. However, Blickman emphasized that AI applications will continue to necessitate advanced packaging due to the introduction of new devices and planned developments for 2026-2028.
Degroof Petercam analysts believe BESI’s leadership in hybrid bonding technology positions the company favorably for growth by the end of 2025 or early 2026.
BESI, a supplier of advanced packaging equipment, announced on Wednesday, March 23rd, that its order volume increased in the first quarter, driven by rising demand from Asian foundries for AI-related data center applications. Investors are optimistic about continued growth in orders for BESI’s hybrid bonding solutions, a crucial technology enabling the direct stacking and bonding of chips.
CEO Richard Blickman, in a press release, stated, "We have received hybrid bonding orders from two leading memory chip manufacturers for HBM4, as well as follow-up orders from a leading Asian foundry for logic chips." The company reported a quarterly order value of €131.9 million (approximately $150.1 million), an 8.2% increase compared to the previous quarter.
Despite a year-to-date stock price decline of roughly 30%, BESI's shares rose by approximately 9% following the earnings report. KBC Securities analysts highlighted that these new orders are a positive indicator and reinforce the company’s long-term growth potential, despite potential short-term volatility.
BESI’s first-quarter revenue was €144.1 million, a 6.1% decrease compared to the previous quarter, primarily due to weaker shipments in mobile device and automotive applications. The company anticipates second-quarter revenue to remain consistent, with potential deviations of around 5%. Blickman noted the increasing difficulty in predicting the timing of demand recovery amid escalating trade tensions.
In February, BESI had projected a rebound in the mainstream assembly market beginning in the second half of this year, contingent on terminal market trends and progress in resolving global trade restrictions. However, Blickman emphasized that AI applications will continue to necessitate advanced packaging due to the introduction of new devices and planned developments for 2026-2028.
Degroof Petercam analysts believe BESI’s leadership in hybrid bonding technology positions the company favorably for growth by the end of 2025 or early 2026.