
BESI Semiconductor Secures Hybrid Bonding Orders for HBM4 from Key Manufacturers
26 April 2025 · ·
BESI, a supplier of advanced packaging equipment, has reported a significant increase in orders, driven primarily by adoption of hybrid bonding solutions for HBM4 applications from two major memory chip manufacturers and one leading Asian foundry. While the company’s first-quarter revenues declined, order volume rose by 8.2% compared to the previous quarter. Analysts remain optimistic, anticipating continued growth for BESI despite potential short-term market fluctuations.
Read More →